NOCS 2012
Keynote Talk - Paul D. Franzon
Abstract:
After years of research and development, Through-Silicon Vias (TSVs) are becoming a manufacturing reality. Soon, a wave a new TSV-based 3D stacked ICs (and “2½D”-stacked ICs) will hit the market, including CMOS image sensors, memory cubes, stacked FPGAs, and memory-on-logic. This will be followed by a set of more sophisticated products likely to have a focus on heterogeneous integration. For digital systems, one particularly benefit for going into the third dimension is reduced power consumption. However, to justify the investment it must be possible to achieve power savings of 25% or more. This cannot be achieved solely through shorter wires! 3D-specific design solutions are needed.
A particular complexity in 3D integration is that designs that might be assembled into a 3D stack are likely to be designed at different times and places. This creates the need for common interface IP and interchange standards. The requirements and progress towards these will be presented and discussed.
Biography:
Paul D. Franzon is currently a Professor of Electrical and Computer Engineering at North Carolina State University. He earned his Ph.D. from the University of Adelaide, Adelaide, Australia in 1988. He has also worked at AT&T Bell Laboratories, DSTO Australia, Australia Telecom and two companies he cofounded, Communica and LightSpin Technologies. His current interests center on the technology and design of complex systems incorporating VLSI, MEMS, advanced packaging and nano-electronics. He has lead several major efforts and published over 200 papers in these areas. In 1993 he received an NSF Young Investigators Award, in 2001 was selected to join the NCSU Academy of Outstanding Teachers, in 2003, selected as a Distinguished Alumni Professor, and in 2005 won the Alcoa award. He is a Fellow of the IEEE.
Design of 3D Specific Systems:
Prospectives and Interface Requirements
Paul Franzon - North Carolina State University, USA