Organizing Committee

General Chair:

1. ‣Jens Sparsø, Technical University of Denmark, Denmark
   

2. ‣JAN MADSEN, Technical University of Denmark, Denmark
   

Program co-chairs:

1. ‣DIANA MARCULESCU, Carnegie Mellon University, USA
   

2. ‣Chita R. Das, Pennsylvania State University, USA
   

Tutorial/Demo/Special-Sessions co-chairs:

1. ‣Jose Flich, University of Valencia, Spain
   

2. ‣DAVID BERTOZZI, University of Ferrara, Italy
   

Invited Speakers Chair:

1. ‣Steve Furber, University of Manchester, UK
   

Industry Chair:

1. ‣JOHN BAINBRIDGE, University of Manchester, UK
   

2. ‣MIKE KISHINEVSKY, Intel, USA
   

Finance Chair:

1. ‣Flemming Stassen, Technical University of Denmark, Denmark
   

Publications Chair:

1. ‣KEN STEVENS, University of Utah, USA
   

Registrations Chair:

1. ‣Martin Schoeberl, Technical University of Denmark, Denmark
   

Local Arrangements Chair

1. ‣Pia Lauridsen, Technical University of Denmark, Denmark
   

 

Publicity Chair

1. ‣MAURIZIO PALESI, Kore University, Italy
   

Web Chair

1. ‣LAURA MICCONI, Technical University of Denmark, Denmark
   

Technical Program Committee

ASIT MISHRA, Intel Inc. , USA

PAUL AMPADU, Univ. of Rochester, USA

AHMED LOURI, Univ. of Arizona, USA

ANDREAS HANSSON, ARM, UK

AXEL JANTSCH, KTH Royal Institute of Technology, Sweden

BENJAMIN LEE, IBM, USA

BILL LIN, Univ. of California, San Diego, USA

DINESH PAMUNUWA, Lancaster Univ. , UK

DAVIDE BERTOZZI, Univ. of Ferrara, Italy

DAN ZHAO, Univ. of Louisiana at Lafayette, USA

ERIKA COTA, Universidade Federal do Rio Grande do Sul, Brazil

FABIEN CLERMIDY, CEA-LETI, France

FEDERICO ANGIOLINI, iNoCS, Switzerland

FERNANDO MORAES, Pontifícia Univ. do Rio Grande do Sul, Brazil

JÖRG HENKEL, Karlsruhe Institute of Technology, Germany

JOSÉ FLICH, Univ. Politécnica de Valencia, Spain

JOHN KIM, Korea Advanced Institute of Science and Technology, Korea

JUAN YANG, University of Pittsburgh, USA

KEES GOOSSENS,NXP, The Netherlands

KARAM CHATHA, Arizona State Univ. , USA

LORENA ANGHEL, TIMA, INP Grenoble, France

LUCA BENINI, Univ. of Bologna, Italy

LUCA CARLONI, Columbia Univ. , USA

MARTIN RADEZKI, Univ. of Stuttgart, Germany

MAURIZIO PALESI, Kore University, Italy

MICHAEL TAYLOR, Univ. of California, San Diego, USA

MIKE KISHINEVSKY, Intel Inc., USA

MIKKO LIPASTI, Univ. of Wisconsin-Madison, USA

NICOLA NICOLICI, McMaster Univ. , Canada

CHRYS NICOPOULUS, University of Cyprus, Cyprus

STEVEN NOWICK, Columbia Univ. , NY, USA

ONUR MUTLU, Carnegie Mellon Univ. , USA

PARTHA PANDE, Washington State Univ. , USA

PARTHA KUNDU, Juniper Networks, USA

LI-SHIUAN PEH, Massachusetts Institute of Technology, USA

PETRU ELES, Linköping Univ. , Sweden

PAUL GRATZ, Texas A&M University, USA

RADU MARCULESCU, Carnegie Mellon Univ. , USA

RAJEEV BALASUBRAMONIAN, Univ. of Utah, USA

REETU DAS, Univ. of Michigan, USA

RICCARDO LOCATELLI, STMicroelectronics, France

ROBERT MULLINS, Univ. of Cambridge, UK

SIDDHARTH GARG, University of Waterloo, Canada

CRISTINA SILVANO, Politecnico di Milano, Italy

SRINIVASAN MURALI, iNoCS, Switzerland

SRIRAM VANGAL, Intel Inc. , USA

SUDEEP PASRICHA, Colorado State Univ. , USA

SUDHAKAR YALAMANCHILI, Georgia Institute of Technology, USA

TERRENCE MAK, Newcastle Univ. , UK

ÜMIT OGRAS, Intel Inc. , USA

VIJAY NARAYAN, The Pennsylvania State Univ. , USA

JOHN BAINBRIDGE, Silistix, UK

ZHONGHAI LU, KTH Royal Institute of Technology, Sweden

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